Method for doping semiconductor substrates by means of a co-diffusion process and doped semiconductor substrate produced by means of said method
US10593552B2 · kind B2 · utility
0Cited by
0References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2016 |
| Grant date | Mar 17, 2020 |
| Priority date | — |
| Expiry date | Dec 16, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a method for doping semiconductor substrates by means of a co-diffusion process. First, semiconductor substrates are coated at least on one side with a layer containing at least one first dopant. Two of said substrates in each case are arranged in a process chamber in such a way that two of the coated sides thereof are brought in direct contact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.