Heart transfer label structure
US10593648B2 · kind B2 · utility
0Cited by
11References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2018 |
| Grant date | Mar 17, 2020 |
| Priority date | — |
| Expiry date | Jul 2, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.