Three-dimensional package structure
US10593656B2 · kind B2 · utility
0Cited by
9References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 19, 2017 |
| Grant date | Mar 17, 2020 |
| Priority date | — |
| Expiry date | Feb 1, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention discloses a three-dimensional package structure. The first conductive element comprises a top surface, a bottom surface and a lateral surface. The conductive pattern disposed on the top surface of the first conductive element. A second conductive element is disposed on the conductive pattern. The first conductive element is electrically connected to the conductive pattern, and the second conductive element is electrically connected to the conductive pattern. In one embodiment, the shielding layer is a portion of the patterned conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.