Planar balun and multi-layer circuit board
US10594290B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2017 |
| Grant date | Mar 17, 2020 |
| Priority date | — |
| Expiry date | Jan 30, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F2027/2809
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention provides a planar balun and a multi-layer circuit board. The planar balun formed on the multi-layer circuit board comprises: a first winding with at least one turn, which is formed in a first conductive layer, and has a first lead and a second lead serving as a first balanced end and a second balanced end of the balun respectively; a second winding with at least one turn, which is formed in a second conductive layer separated from the first conductive layer by at least a first insulating layer, and has a third lead and a fourth lead, wherein the third lead is connected to a ground potential, and the fourth lead serves as an unbalanced end of the balun; and a first balancing capacitor, which is connected between a selected portion near a center of the first winding and the ground potential.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.