PCB with minimized crosstalk
US10595394B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 9, 2019 |
| Grant date | Mar 17, 2020 |
| Priority date | — |
| Expiry date | May 9, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board includes additional stitching vias placed at strategic location within a connection matrix, which provides additional isolation and further accommodates high-speed communication capabilities. The stitching vias have a variable length or depth, depending on related structures within the circuit board, so as to avoid any interference with underlining escape routing, or alternative signal transmission structures. More specifically, these stitching vias help to eliminate cross-talk in the via field caused by the close proximity of signal carrying structures. Further, differential signal communication is better accommodated based upon this reduction in cross-talk.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.