Board having electronic element, method for manufacturing the same, and electronic element module including the same
US10595413B2 · kind B2 · utility
2Cited by
7References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 14, 2017 |
| Grant date | Mar 17, 2020 |
| Priority date | — |
| Expiry date | Apr 14, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0191
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board includes a board portion and an electronic element. The board portion includes a first substrate having an element accommodating portion and second substrates laminated on outer surfaces of the first substrate. The electronic element is disposed in the element accommodating part. The electronic element includes a heat generating element and a heat radiating member coupled to an inactive surface of the heat generating element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.