Method of manufacturing flexible electronic circuits having conformal material coatings
US10595417B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2016 |
| Grant date | Mar 17, 2020 |
| Priority date | — |
| Expiry date | Aug 15, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/308
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a flexible electronic circuit is provided. The method may include forming a positive photoresist mold on a flexible polymer substrate having a plurality of metal traces. The method may also include applying a conformal material coating over the positive photoresist mold, the flexible polymer substrate, and the metal traces. The method may further include removing an excess of the conformal material coating by running a blade over the positive photoresist mold. The method may also include removing the positive photoresist mold to reveal a cavity defined by the conformal material coating. The method may further include dispensing an anisotropic conductive paste into the cavity and inserting a chip into the cavity and bonding the chip to the metal traces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.