Encapsulation structure and display apparatus
US10595420B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Dec 27, 2016 |
| Grant date | Mar 17, 2020 |
| Priority date | — |
| Expiry date | May 31, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/131
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An encapsulation structure and a related display apparatus are provided. The encapsulation structure includes a first substrate having a sealing region; a metal pattern on the sealing region; a thermal conductive layer, at least covering the metal pattern and electrically insulated from the metal pattern; and a sealing structure on the thermal conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.