Electronic stickers with modular structures

US10595781B2 · kind B2 · utility

Assignee

• VivaLnk, Inc. · US

Inventors

• Junfeng Mei · San Jose, US
• Jiang Li · Beijing, CN

Key dates

• Filing date: May 15, 2018
• Grant date: Mar 24, 2020
• Expiry date: Jul 11, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H04B5/24
• WIPO field: Medical technology
• WIPO sector: Instruments

Abstract

An electronic sticker assembly includes a first electronic sticker comprising an upper surface, a lower surface, and first one or more conductive connection dots on the upper surface, a first adhesive layer on the first electronic sticker and comprising a first window. The first window is positioned to expose the first one or more conductive connection dots. A second electronic sticker on the first adhesive layer includes a lower surface and one or more second conductive connection dots on the lower surface. The first conductive connection dots on the upper surface of the first electronic sticker are in contact with the one or more second conductive connection dots on the lower surface of the second electronic sticker through the first window in the first adhesive layer.