Ultrasound transducer and method for wafer level front face attachment
US10596598B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2016 |
| Grant date | Mar 24, 2020 |
| Priority date | — |
| Expiry date | Dec 3, 2037 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61B8/4483
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Methods and systems are provided for a single element ultrasound transducer. In one embodiment, the ultrasound transducer comprises: a piezoelectric layer, a matching layer, one surface of the matching layer is electrically coupled to a top surface of the piezoelectric layer and another surface of the matching layer forms a signal pad within a front face of the ultrasound transducer, and a base package electrically coupled to a bottom surface of the piezoelectric layer, the base package extending horizontally and laterally to form a back face of the ultrasound transducer parallel to the front face of the ultrasound transducer, and extending vertically relative to the back face of the ultrasound transducer to form a ground pad within the front face of the ultrasound transducer. In this way, the transducer can work robustly and may be automatically mounted to a flat substrate with printed circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.