Substrate for printed circuit board and printed circuit board
US10596782B2 · kind B2 · utility
0Cited by
4References
14Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 1, 2016 |
| Grant date | Mar 24, 2020 |
| Priority date | — |
| Expiry date | Jun 4, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/095
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A substrate for a printed circuit board according to an embodiment of the present invention includes a resin film and a metal layer stacked on at least one of surfaces of the resin film. An average diffusion depth of a main metal of the metal layer in the resin film is 100 nm or less after a weather resistance test in which the substrate is held at 150° C. for seven days. The average diffusion depth is preferably 80 nm or less before the weather resistance test.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.