Edge chamfering methods
US10597321B2 · kind B2 · utility
3Cited by
129References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2015 |
| Grant date | Mar 24, 2020 |
| Priority date | — |
| Expiry date | Jan 27, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24777
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Processes of chamfering and/or beveling an edge of a glass substrate of arbitrary shape using lasers are described herein. Two general methods to produce chamfers on glass substrates are the first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser to create perforations within the glass; followed by an ion exchange.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.