Epoxy compound, mixture, composition, and cured product comprising same, method for preparing same, and use thereof
US10597412B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 17, 2015 |
| Grant date | Mar 24, 2020 |
| Priority date | — |
| Expiry date | Jul 19, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2363/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a novel epoxy compound, a method for preparing same, a composition and cured product comprising same, and use thereof, wherein the compound shows excellent heat-resistant properties—specifically, a low thermal expansion property and a high glass transition temperature (including Tg-less which does not show a glass transition temperature), a flame retardant property and processability—specifically, a viscosity-control property, does not require a separate silane coupling agent, and has improved brittleness in a composite. According to one aspect of the present invention, provided are: an epoxy compound having at least one non-reactive silyl group, alkenyl group or combination thereof together with at least two epoxy groups and at least one alkoxysilyl group; a method for preparing the epoxy compound through alkoxysilylation and alkylsilylation; an epoxy composition comprising same; and a cured product.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.