Label removal solution for low temperature and low alkaline conditions
US10597615B2 · kind B2 · utility
0Cited by
29References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2018 |
| Grant date | Mar 24, 2020 |
| Priority date | — |
| Expiry date | Apr 27, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/18
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
According to the invention, the compositions and methods provide for the complete removal of synthetic glues or adhesives from a plurality of surfaces through the use of amide solvents in combination with surfactants, chelants, acidulants and/or additional bottle wash additives. Beneficially, the compositions and methods are suitable for use at lower temperatures, including below 35° C., and lower pH conditions, including from 5 to 10, from 6 to 9, and from 6 to 8, in comparison to conventional caustic-based adhesive removal compositions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.