Floor panel

US10597876B2 · kind B2 · utility

Assignee

• FLOORING INDUSTIES LIMITED, SARL · LU

Inventors

• Laurent Meersseman · Kortrijk, BE
• Martin Segaert · Ieper, BE
• Bernard Thiers · Oostrozebeke, BE
• Benjamin CLEMENT · American Fork, US
• Christophe Maesen · Lichtervelde, BE

Key dates

• Filing date: Sep 5, 2017
• Grant date: Mar 24, 2020
• Expiry date: Sep 5, 2037

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/24777
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A floor may include a substrate having a top side and a bottom side. A top layer may be provided on the substrate. The top layer may consist of a printed thermoplastic film and a thermoplastic transparent or translucent layer provided on the printed thermoplastic film. The top layer may be directly adhered to the substrate by heat welding the printed thermoplastic film and the top side of the substrate, in the absence of a glue layer. The substrate may be a synthetic material board including a filler. The substrate at least at two opposite edges may include coupling means provided in the synthetic material board. The thermoplastic transparent or translucent layer may be provided with a structure.