Thermal management system
US10598443B2 · kind B2 · utility
0Cited by
8References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2016 |
| Grant date | Mar 24, 2020 |
| Priority date | — |
| Expiry date | Oct 17, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/3672
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Embodiments of a thermal management system are provided herein. In some embodiments, a thermal management system may include a base plate; and a plurality of three dimensional fins coupled to the base, wherein each of the plurality of three dimensional fins comprises a first portion extending away from the base in a first direction and a second a portion extending away from the first portion in a second direction different from the first direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.