Semiconductor memory device
US10600791B2 · kind B2 · utility
3Cited by
3References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2018 |
| Grant date | Mar 24, 2020 |
| Priority date | — |
| Expiry date | Sep 7, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B63/30
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor memory device includes a word line buried in an upper portion of a substrate and extending in a first direction, and a word line contact plug connected to the word line. An end portion of the word line includes a contact surface exposed in the first direction, and the word line contact plug is connected to the contact surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.