Camera module
US10600832B2 · kind B2 · utility
1Cited by
1References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2018 |
| Grant date | Mar 24, 2020 |
| Priority date | — |
| Expiry date | Sep 14, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/811
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A camera module includes a circuit board, a photosensitive chip located on the circuit board and electrically coupled to the circuit board, a package body packaged on the circuit board, and a bracket located on a side of the package body away from the circuit board. The package body includes a bearing surface away from the circuit board, and the bracket includes a first surface adjacent to the package body. A ratio between an area of the first surface and an area of the bearing surface is about 0.5 to about 1.2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.