Manufacturing method for ultrathin white covering film
US10603686B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2017 |
| Grant date | Mar 31, 2020 |
| Priority date | — |
| Expiry date | Apr 19, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H29/14
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Disclosed is a manufacturing method for an ultrathin white covering film. The ultrathin white covering film includes a protecting film, a white ink layer, an adhesive layer and a release material, wherein the manufacturing method for the ultrathin white covering film includes the following steps: S101: preparing white ink and an adhesive; S102: coating the white ink on the protecting film and drying to form a white ink layer; S103: coating the adhesive on the white ink layer and drying to form a adhesive layer; S104: compounding the release material on the adhesive layer and coiling under certain compound temperature and compound pressure; and S105: curing to obtain the ultrathin white covering film. The present invention reduces a polyimide film layer, reduces a use part from three layers to two layers, can greatly reduce the thickness of a product, make an appearance of the product better, and greatly reduces the price.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.