Bonded diamond body, tool comprising the same, and method for manufacturing bonded diamond body
US10603720B2 · kind B2 · utility
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5References
3Claims
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Key dates
| Filing date | Oct 8, 2014 |
| Grant date | Mar 31, 2020 |
| Priority date | — |
| Expiry date | Dec 28, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22C2204/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A bonded diamond body having a high bonded strength is provided. The bonded diamond body includes a sintered polycrystalline diamond body, a hard substrate, and a hard layer provided between the sintered polycrystalline diamond body and the hard substrate, the sintered polycrystalline diamond body containing a diamond grain and a sintering aid, the hard substrate containing tungsten carbide and cobalt, and the hard layer containing cobalt and a hard grain made of a carbide, a nitride, or a carbonitride having a Vickers hardness of 1100 Hv or more.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.