Method and apparatus for polishing metal parts with complex geometries
US10603731B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2015 |
| Grant date | Mar 31, 2020 |
| Priority date | — |
| Expiry date | Jul 20, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25F7/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The polishing system includes a power supply. The polishing system also includes a container including an interior portion. The interior portion includes a conductive material thereon. The conductive material is electrically coupled to the power supply. The polishing system also includes an electrolytic solution disposed within the container. The electrolytic solution includes a plurality of abrasive particles. The polishing system further includes a flexible media disposed within the container. The container is configured to contain an object. The power supply configured to electrically couple to the object. Each of the electrolytic solution, the flexible media, and the abrasive particles is configured to partially polish the object substantially simultaneously.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.