Die with aligning mechanism, and manufacturing device and method for enameled wire
US10603832B2 · kind B2 · utility
0Cited by
5References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2018 |
| Grant date | Mar 31, 2020 |
| Priority date | — |
| Expiry date | Feb 9, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S118/22
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A die with alignment mechanism includes a die including a through-hole through which a traveling wire travels, a bearing member for rotationally moving the die in a circumferential direction of the traveling wire, and a movable member that moves the die so that a central axis of the through-hole is aligned with a travel direction of the traveling wire without inhibiting the rotational movement of the die produced by the bearing member when the travel direction changes in a direction orthogonal to the travel direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.