Pin die thermoforming apparatus
US10603835B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2017 |
| Grant date | Mar 31, 2020 |
| Priority date | — |
| Expiry date | Dec 19, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2791/006
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A thermoforming apparatus is described herein. The apparatus may include a pressure mechanism, a thermal device, a plurality of individually actuatable pins, and/or a pin actuation mechanism. The pressure mechanism may create a force against a die surface. The thermal device may change a thermal state of a material forced by the pressure mechanism against the die surface. The plurality of individually actuatable pins may form the die surface. The pin actuation mechanism may be connected to the plurality of actuatable pins and/or may actuate the pins. This apparatus improves on prior solutions in many ways. For example, embodiments of the thermoforming apparatus may require significantly less time between different molds than previous thermoforming machines and 3D printers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.