Process for molding a thermosetting resin
US10603850B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2015 |
| Grant date | Mar 31, 2020 |
| Priority date | — |
| Expiry date | Jan 3, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2063/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of molding a thermosetting resin, in particular of the epoxy resin type, in which a first mold is filled with the resin while causing the temperature of the resin to vary in application of a first temperature program, without exceeding the Tg of the resin. After the first mold has been filled, the resin is put under pressure while causing the temperature of the resin to vary in application of a second temperature program, without exceeding Tg, and a drop in the pressure exerted by the resin on the mold is detected with the instant at which this pressure presents a break of slope being identified as the instant t1. A second mold is filled with the thermosetting resin in application of the first temperature program. After the second mold has been filled, the resin is put under pressure in application of the second temperature program until an instant t2 close to t1. As from t2, the temperature of the resin is increased to exceed Tg.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.