Methods and apparatus for positioning a structure on a polymer layer
US10603854B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 11, 2017 |
| Grant date | Mar 31, 2020 |
| Priority date | — |
| Expiry date | May 23, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02C7/04
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Methods and apparatus for positioning a structure on a polymer layer are described. A method may involve forming a first polymer layer. The method may further involve positioning, by an apparatus, a structure on the first polymer layer, where the apparatus comprises a rod having a first end that supports the structure as the structure is being positioned and a plunger located around the first end of the rod that presses the structure onto the first polymer layer as the structure is being positioned. And the method may involve forming a second polymer layer over the first polymer layer and the structure, where the first polymer layer defines a first side of a body-mountable device and the second polymer layer defines a second side of the body-mountable device opposite the first side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.