MEMS device, liquid ejecting head, and liquid ejecting apparatus
US10603914B2 · kind B2 · utility
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11Claims
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Key dates
| Filing date | Nov 13, 2018 |
| Grant date | Mar 31, 2020 |
| Priority date | — |
| Expiry date | Nov 13, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an MEMS device, in a Z direction that is a direction in which a first core portion, a plurality of first bump wiring, and a plurality of first individual wiring are laminated, a width between the first core portion and a wiring substrate is wider than a maximum particle diameter of solid particles contained in an adhesive, and a width between a first wiring and a second wiring and a width between a third wiring and a fourth wiring are wider than the maximum particle diameter of the solid particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.