Film-forming silica sol, method of preparing the same, and application of the same

US10604662B2 · kind B2 · utility

Assignees

• Shanghai Xinanna Electronic Technology Co., Ltd. · CN
• SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY CHINESE ACADEMY OF SCIENCES · CN

Inventors

• Yongxia Wang · Bound Brook, US
• Weili Liu · Shanghai, CN
• Zhitang Song · Shanghai, CN

Key dates

• Filing date: Jul 26, 2016
• Grant date: Mar 31, 2020
• Expiry date: Oct 9, 2036

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08K3/36
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

The present disclosure relates to the field of preparing an inorganic nanometer material and application thereof, and specifically relates to a film-forming silica sol, a method of preparing the silica sol, and usage thereof. The present disclosure provides a film-forming silica sol comprising, by weight percentage, constituents of: silica sol: 66-91%; modifying agent: 0.1-1.8%; film-forming auxiliary: 7.2-33.9%. The present disclosure further provides a method of preparing a film-forming silica sol and an application thereof. With the film-forming silica sol, a method of preparing the silica sol, and usage thereof according to the present disclosure, the prepared film-forming silica sol has a good appearance transparency and stability, and when applied to paint as a film-forming coating, it has a good glossiness, a high hardness, and a strong adhesive force; therefore, it has a high practical value in the paint field.