Silicone pressure-sensitive adhesive composition
US10604688B2 · kind B2 · utility
0Cited by
5References
14Claims
0Family size
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Key dates
| Filing date | Dec 12, 2016 |
| Grant date | Mar 31, 2020 |
| Priority date | — |
| Expiry date | Feb 27, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G2170/40
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A silicone pressure-sensitive adhesive composition is curable by an addition reaction, condensation reaction, or a radical reaction with the use of an organic peroxide, and is characterized by comprising an azeotropic solvent such as a mixture of an aromatic solvent, and an aliphatic alcohol or an aliphatic ester. Although the silicone pressure-sensitive adhesive composition can be cured by heating at relatively low temperatures, the residual solvent in a silicone pressure-sensitive adhesive can be reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.