Copper electroplating baths containing compounds of reaction products of amines, polyacrylamides and sultones
US10604858B2 · kind B2 · utility
1Cited by
2References
5Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Oct 8, 2015 |
| Grant date | Mar 31, 2020 |
| Priority date | — |
| Expiry date | Dec 6, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D7/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Copper electroplating baths include reaction products of amines, polyacrylamides and sultones. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.