Encapsulated sensors and electronics
US10605071B2 · kind B2 · utility
0Cited by
7References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2016 |
| Grant date | Mar 31, 2020 |
| Priority date | — |
| Expiry date | Jul 22, 2038 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE21B49/08
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
An electrical assembly of a downhole tool utilized within a wellbore extending into a subterranean formation. The electrical assembly includes a housing substantially formed of thermoplastic material, an electronic device sealed within the housing, and an electrode or sensor sealingly embedded within a wall of the housing and electrically connected with the electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.