Vapor chamber that utilizes a capillary structure and bumps to form a liquid-vapor channel
US10605540B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2018 |
| Grant date | Mar 31, 2020 |
| Priority date | — |
| Expiry date | Nov 6, 2038 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2270/00
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A vapor chamber includes a first panel defining an evaporation region, a thermal insulation region and a condensation region, a second panel joined to the first panel to define an enclosed accommodation space therebetween, a capillary material disposed in the accommodation space, and a working fluid. The first panel has a plurality of first bumps disposed within the accommodation space and distributed in the evaporation region, the thermal insulation region and the condensation region and abutted against the capillary material. The capillary material has a hollow portion located in the thermal insulation region to expose a part of the first bumps. The second panel has a plurality of second bumps abutted against the first bumps in the hollow portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.