Shock-isolated mounting device with a thermally-conductive link
US10605820B2 · kind B2 · utility
0Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2017 |
| Grant date | Mar 31, 2020 |
| Priority date | — |
| Expiry date | May 26, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/2049
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A shock-isolated mounting device and a method and system are provided. For example, the shock-isolated mounting device includes an enclosure configured to support the mounting device, at least one damper attached between the mounting device and the enclosure, and a thermally-conductive element disposed on a surface of the mounting device and configured to thermally couple the mounting device to the enclosure. The thermally-conductive element facilitates the dissipation of heat generated by electronic components mounted onto the shock-isolated mounting device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.