Template for imprint lithography and methods of making and using the same
US10606170B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 14, 2017 |
| Grant date | Mar 31, 2020 |
| Priority date | — |
| Expiry date | Dec 30, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B99/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A template for imprint lithography can include an active area that includes a plurality of tiers including a first tier and a second tier, and a first feature within the first tier or the second tier. In another embodiment, the first and second tiers include features, and the average feature depth or height within the first tier may be substantially the same as or different from the average feature depth or height within the second tier. The template can be used in imprinting a formable layer to form a patterned resist layer over a device substrate that has at least two tiers. The template and its use are well suited for device substrates having exposed surfaces at significantly different elevations, particularly where planarization would be complicated or nearly impossible to implement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.