Thermal management components for electronic devices
US10606325B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 31, 2018 |
| Grant date | Mar 31, 2020 |
| Priority date | — |
| Expiry date | May 31, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/1631
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thermal management system that includes a fan assembly, a heat exchanger, and an insulating box is described. The fan assembly can have two impellers and a housing that includes two scroll portions. An internal portion of the scroll wall can be truncated. A motor housing can be connected to the fan housing via multiple struts. The struts can be oriented angularly with a tangential component and can slope inward to increase the effective inlet area. The heat exchanger can be formed of a fin stack that has a curved body that defines an airflow path that turns radially from the inlet to the exhaust. The heat exchanger can have an inlet that is smaller than the exhaust. The heat exchanger can be connected to one or more heat pipes. The insulating box can have a grid that directs air to certain specific directions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.