Patent · US Active

Heat reduction using selective insulation and thermal spreading

US10606327B2 · kind B2 · utility

0Cited by

3References

26Claims

0Family size

Assignee

QUALCOMM Incorporated · US

Inventors

Victor A. Chiriac · San Diego, US
Jorge Luis Rosales · San Diego, US
Peng Wang · San Diego, US

Key dates

Filing date	Jun 16, 2017
Grant date	Mar 31, 2020
Priority date	—
Expiry date	Jun 16, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH05K7/20963
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

Techniques for heat reduction are disclosed. An apparatus may include a heat-generating component, an insulative layer having a first surface in contact with the heat-generating component and a second surface opposite the first surface, and a heat-conducting component disposed on the second surface of the insulative layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.