Substrate
US10607917B2 · kind B2 · utility
0Cited by
2References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 9, 2019 |
| Grant date | Mar 31, 2020 |
| Priority date | — |
| Expiry date | May 9, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10409
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate includes a circuit board, a heat generator mounted over a mounting surface of the circuit board, a heat sink in contact with the heat generator, a retainer attached to the mounting surface so as to retain the heat generator and reinforce the circuit board, and a fastener configured to fix the heat sink to the retainer so as to bring the heat sink into contact with the heat generator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.