Dual-sided radio-frequency package with overmold structure
US10607944B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2017 |
| Grant date | Mar 31, 2020 |
| Priority date | — |
| Expiry date | Oct 4, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaged radio-frequency device is disclosed, including a packaging substrate configured to receive one or more components, the packaging substrate including a first side and a second side. A shielded package may be implemented on the first side of the packaging substrate, the shielded package including a first circuit and a first overmold structure, the shielded package configured to provide radio-frequency shielding for at least a portion of the first circuit. A set of through-mold connections may be implemented on the second side of the packaging substrate, the set of through-mold connections defining a mounting volume on the second side of the packaging substrate. The device may include a component implemented within the mounting volume and a second overmold structure substantially encapsulating one or more of the component or the set of through-mold connections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.