Substrate-less waveguide active circuit module with current mode power combining
US10607953B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 20, 2018 |
| Grant date | Mar 31, 2020 |
| Priority date | — |
| Expiry date | Dec 20, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1423
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device includes an enclosure cover having a groove portion disposed on one surface, a chip carrier attachable to and removable from the enclosure cover in the groove portion, the chip carrier including at least two cavities disposed on one surface and located on opposite sides, each cavity has a slot extending to an opposite surface of the chip carrier. Also included is a ridge gap waveguide (RGW) cover with a plurality of pillars disposed on one surface, and a plurality of ridges are also disposed on the one surface. Each ridge includes a branching junction such that each ridge branches to at least two ridge portions. The enclosure cover and the RGW cover are configured to connect to each other with the chip carrier located therebetween, and the opposite surface of the chip carrier faces the one surface of the RGW cover.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.