Wafer level sensing module
US10608135B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2018 |
| Grant date | Mar 31, 2020 |
| Priority date | — |
| Expiry date | Aug 30, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01S17/48
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The instant disclosure provides a wafer level sensing module and a manufacturing method thereof. The wafer level sensing module includes a chip substrate, a proximity sensing unit, and an ambient light sensing unit. The proximity sensing unit is disposed on the chip substrate and includes an emitter, a first receptor, and a shielding assembly. The shielding assembly includes a first shielding member, a second shielding member, a third shielding member, a first lens, and a second lens. The ambient light sensing unit is disposed on the chip substrate and is separate from the proximity sensing unit. The ambient light sensing unit includes a second receptor and a transparent shielding plate. The first receptor and the second receptor are formed on the chip substrate and exposed from a top surface of the chip substrate, and the transparent shielding plate corresponds in position to the second receptor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.