Method for manufacturing multilayer components, and multilayer component
US10608161B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2016 |
| Grant date | Mar 31, 2020 |
| Priority date | — |
| Expiry date | Nov 28, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/50
Abstract
A method for manufacturing multilayer components, and a multilayer component are disclosed. The method includes manufacturing a body comprising electrically conductive layers and dielectric layers which are stacked one above the other, wherein the body comprises at least one cavity and at least partially filling the cavity with an insulation material using capillary forces. The method further includes after partially filling the cavity, singulating the body into at least two base bodies and applying a passivation layer to surfaces of the singulated base bodies, wherein the passivation layer comprises a material which is different from the insulation material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.