Modular quick-release liquid heat removal coupling system for electronic racks
US10609840B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2017 |
| Grant date | Mar 31, 2020 |
| Priority date | — |
| Expiry date | Nov 24, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20781
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic rack includes a heat removal liquid manifold, a number of server slots, and a number of server blades inserted therein. The liquid manifold distributes heat removal liquid from an external heat removal system to remove heat from the server blades. Each server blade includes a server tray to contain information technology (IT) components and a quick-release coupling assembly having a first liquid intake connector and a first liquid outlet connector coupled to a flexible hose to distribute the heat removal liquid to the IT components. The first liquid intake connector and the first liquid outlet connector are capable of extending outwardly external to the server tray to connect to, and disconnect from, a second liquid intake connector and a second liquid outlet connector mounted on the liquid manifold, respectively. The quick-release coupling assembly can self-retract and be secure to a block holder when disconnected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.