Patent · US Active

Second surface laser ablation

US10610975B2 · kind B2 · utility

0Cited by

5References

18Claims

0Family size

Assignee

GENTEX CORPORATION · US

Inventors

Henry A. Luten · Holland, US
Kurtis L. Geerlings · Zeeland, US
Donald L. Bareman · Zeeland, US

Key dates

Filing date	Feb 15, 2018
Grant date	Apr 7, 2020
Priority date	—
Expiry date	Feb 15, 2038

Classification

Technology area (CPC G)Physics
CPC primaryG02F1/153
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method of removing material from an opposite side of workpiece includes directing a laser beam at a first side of the workpiece to remove the material from an opposite second side of the workpiece.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.