Solder paste for reduction gas, and method for producing soldered product
US10610981B2 · kind B2 · utility
3Cited by
0References
23Claims
0Family size
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Key dates
| Filing date | Sep 29, 2016 |
| Grant date | Apr 7, 2020 |
| Priority date | — |
| Expiry date | Sep 29, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1157
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention provides a solder paste free of reducing agents and activators, and a method for producing a soldered product in which the solder paste is used to achieve solder bonding. The solder paste for reducing gas of the present invention is a solder paste for reducing gas used together a reducing gas. The solder paste contains a solder powder; a thixotropic agent that is solid at normal temperature; and a solvent, and is free of reducing agents for removal of oxide films and free of activators for improvement of reducibility.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.