Composition for adhesion, stacked structure using the same, and electronic device using the same
US10611937B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 23, 2018 |
| Grant date | Apr 7, 2020 |
| Priority date | — |
| Expiry date | May 31, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/011
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided are a composition for adhesion, a stacked structure including the same, and an electronic device including the same. The composition for adhesion may include an acrylic resin and a silane compound. The acrylic resin may have a weight average molecular weight of about 100,000 g/mol to about 200,000 g/mol, and may include a polymerization unit derived from a monomer represented by Formula A1 and a polymerization unit derived from a monomer represented by Formula A2. The silane compound may have a weight average molecular weight of about 300 g/mol to about 2,000 g/mol, and a polymerization unit derived from a monomer represented by Formula B.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.