SnAg alloy plating solution
US10612150B2 · kind B2 · utility
1Cited by
1References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2016 |
| Grant date | Apr 7, 2020 |
| Priority date | — |
| Expiry date | Jan 15, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC07D257/04
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
The SnAg alloy plating solution of the invention is a SnAg alloy plating solution including a water-soluble tin compound, a water-soluble silver compound, and a particular sulfide compound in an amount in the range of 0.25 mol or more and 10 mol or less with respect to 1 mol of silver in the water-soluble silver compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.