Housing for electronic devices including air outlet with fluid ingress mitigation
US10612811B2 · kind B2 · utility
0Cited by
91References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 2, 2017 |
| Grant date | Apr 7, 2020 |
| Priority date | — |
| Expiry date | Mar 31, 2038 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF24F2110/10
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A housing for an electronic device includes a rear wall with an exterior surface, a top wall, a ledge with an exterior surface, and an air outlet formed between the top wall and the ledge. The ledge is positioned below the top wall. The exterior surface of the ledge is positioned at an exterior angle less than 90° relative to the exterior surface of the rear wall.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.