Thermosiphon systems for electronic devices
US10612861B2 · kind B2 · utility
1Cited by
23References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2018 |
| Grant date | Apr 7, 2020 |
| Priority date | — |
| Expiry date | Jul 27, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49393
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermosiphon system includes a condenser, an evaporator, and a condensate line fluidically coupling the condenser to the evaporator. The condensate line can be a tube with parallel passages can be used to carry the liquid condensate from the condenser to the evaporator and to carry the vapor from the evaporator to the condenser. The evaporator can be integrated into the tube. The condenser can be constructed with an angled core. The entire assembly can be constructed using a single material, e.g., aluminum, and can be brazed together in a single brazing operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.