Externally mounted component cooling system
US10613598B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 15, 2018 |
| Grant date | Apr 7, 2020 |
| Priority date | — |
| Expiry date | Jul 14, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20145
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An externally mounted component cooling system includes a chassis defining a chassis housing and including an outer surface that is located opposite the chassis from the chassis housing. An air inlet is defined by the chassis and extends through the chassis from the outer surface to the chassis housing. At least one external component mounting feature is included on the outer surface of the chassis adjacent the air inlet. An external component is coupled to the at least one external component mounting feature. A forced convection device is located in the chassis housing and is configured to generate an airflow through chassis housing. The generation of the airflow by the forced convection device draws air past the external component and through the air inlet to cool the external component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.