PCB board assembling method and assembling system
US10614386B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 26, 2016 |
| Grant date | Apr 7, 2020 |
| Priority date | — |
| Expiry date | Oct 17, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/30
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board (PCB) panelization method and a PCB panelization system are disclosed herein. The PCB panelization method comprises the following steps: S1, reading daughterboard information of purchase orders, wherein the daughterboard information comprises respective areas, delivery quantities and attributes of daughterboards; S2, performing comparison of the daughterboard information, screening for daughterboards having attributes that are the same, and establishing a panelization rule database; S3, selecting panels (PNLs) satisfying requirements according to panelization requirements; S4, selecting, from the daughterboards having the same attributes as the selected panels, daughterboards to be panelized together for the selected panels, and arranging a graphical layout for a panelization of the selected panels. The system comprises: a reading module-used for reading the daughterboard information of the purchase orders; the panelization rule database for storing the information of the screened daughterboards having the same attributes; a panel selecting module used for selecting the panel satisfying the requirements according to the panelization requirements; and a panel…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.