Patent · US Active

Array substrate assembly, method of manufacturing array substrate assembly, display panel and display apparatus

US10615192B2 · kind B2 · utility

0Cited by

0References

20Claims

0Family size

Assignees

Inventors

Yuankui Ding · Beijing, CN
Guangcai Yuan · Beijing, CN
Ce Zhao · Beijing, CN
Bin Zhou · Zhaoqing, CN
Jun Cheng · Beijing, CN
Zhaofan Liu · Beijing, CN
Yingbin Hu · Beijing, CN
Yongchao Huang · Beijing, CN

Key dates

Filing date	Jul 9, 2018
Grant date	Apr 7, 2020
Priority date	—
Expiry date	Jul 9, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH10D99/00
WIPO fieldOptics
WIPO sectorInstruments

Abstract

A method of manufacturing an array substrate assembly, an array substrate assembly manufactured by the method, and a display panel including the array substrate assembly are disclosed. The method includes: providing a substrate, the substrate having a first region as a preset semiconductor-removed region, and a second region as a remaining region; forming, in the first region of the substrate, a semiconductor removing layer corrodible by a corrosive solution; and forming a semiconductor layer on the substrate formed with the semiconductor removing layer, so that the semiconductor layer covers the semiconductor removing layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.